Sputtering & Cathodic Arc Targets

Sputtering & Cathodic Arc Targets

Sputtering Targets For All Shapes and Forms

Many companies turn to Sophisticated Alloys for sputtering targets and cathodic arc targets because they consider us the "one-stop-shop" they trust to provide high purity materials that meet their exacting specifications.

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Since we produce all our alloys in-house using our advanced vacuum induction systems, we can precisely formulate the specific alloy you require for your physical deposition needs. Our comprehensive analytical capability ensures that your product meets your composition and purity requirements. We offer a full range of post-melt processing and machining capabilities, allowing us to deliver your cathodic arc or sputtering target in any desired shape and quantity, whether it’s a one-off target or for mass production.

For target assemblies requiring bonding, we offer both indium and elastomeric bonds. Expedited services are also available.

Simplify Your Supply Chain

We consider Sophisticated Alloys a "mini mill." Not only do we melt your material, but we can also HIP, roll, extrude, heat treat, and machine the material we produce for you. Simplify your supply chain and save time and money by choosing us.

• Vacuum melted alloy targets
• Ceramic targets

Alloy Applications

• Wear Resistant Coatings
• Decorative Coatings
• Disk Drive Media & Heads

• Optical Coatings
• Solar Cells
• Thin Film Devices

Sputter Coating Advantages vs. Disadvantages

Sputter coating is the core thin film deposition process in the semiconductor, disk drive, CD, and optics industries today.

When a suitable gas (usually argon) and a target material (usually metals) are used to create a glow discharge between the cathode and the anode, the sputtering target is bombarded to cause the ejection of atoms from the target material. This process is known as "sputtering." The atoms of the sputtering target are then deposited on a substrate, such as a silicon wafer, solar panel, or optical device, in a process called sputter deposition.

Sputter deposition is a common physical vapor deposition (PVD) method that offers several advantages, including a wide range of deposition materials and high coating quality.

The table below, provided by Stanford Advanced Materials, details the advantages and disadvantages of sputter coating for informational purposes only.

(2) Replication of target composition in the deposited films.

(3) Capable of in-situ cleaning before film deposition by reversing the potential on the electrodes.

(4) Better film quality and step coverage compared to evaporation.

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(5) Adatoms are more energetic, and the film is densified by in-situ ion bombardment, making it easier to heat up to high temperatures compared to evaporation in a vacuum.

(6) More reproducible deposition control – the same deposition rate for the same process parameters, making film thickness control easier through time management.

(7) Ability to use large area targets for uniform thickness across large substrates.

(8) Sufficient target material for multiple depositions.

(9) No x-ray damage.

(2) Higher pressures 1 –100 mtorr (<10-5 torr in evaporation), leading to more contamination unless ultra-clean gases and targets are used.

(3) Deposition rate of some materials is quite low.

(4) Some materials (e.g., organics) degrade due to ion bombardment.

(5) Most of the energy incident on the target becomes heat, which must be removed.

For more information, please visit Sputtering Target Materials

Author:

SAM Sputter Targets

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, and ceramic materials. View all posts by SAM Sputter Targets

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